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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

We will evaluate the internal structure of the device in a comprehensive manner.

MST offers a range of technologies suitable for evaluating the internal structures of electronic devices, and we propose analytical methods tailored to the observation field and objectives. This document presents case studies investigating specific areas of devices using X-ray CT and FIB-SEM. First, we observed the internal structure of the entire sample using X-ray CT to explore specific areas. Next, we used FIB-SEM to examine the detailed structures of the specific features identified on the vias.